FPC / isiike-Flex (ike)
Isiike PCB (ike)
FPC / isiike-Flex (ike)
| Layer gụọ | 1-28 n'ígwé |  |
| Laminates ụdị | FR-4 (High Tg, Halogen Free, Nnukwu Oge) PTFE, BT, Getek, Aluminium isi ， Copper base ， KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
|
| Ọkpụrụkpụ Board | 6-240mil | |
| Max Base ọla kọpa ibu | 210um (6oz) maka akwa dị n'ime 210um (6oz) maka akwa oyi akwa | |
| Min n'ibu malite ịgba size | 0.2mm (0.008 ″) | |
| Akụkụ ruru | 12: 1 | |
| Max panel size | Sigle n'akụkụ ma ọ bụ n'akụkụ abụọ: 500mm * 1200mm, | |
| Otutu otutu: 508mm X 610mm (20 ″ X 24 ″) | ||
| Min akara obosara / oghere | 0.076mm / 0.076mm (0.003 ″ / 0.003 ″) / 3mil / 3mil | |
| Typedị oghere site na ụdị | Onye kpuru ìsì / lie / Plugged (VOP, VIP…) | |
| HDI / Microvia | EE | |
| Elu imecha | HASL | |
| Duru free HASL | ||
| Imikpu Gold (ENIG), Imikpu Tin, Imikpu ọlaọcha | ||
| Mgbanwe nke Organic Solderability (OSP) / ENTEK | ||
| Flash Gold (Ike Gold plating) | ||
| ENEPIG | ||
| Nhọrọ Gold plating, Gold ọkpụrụkpụ ruo 3um (120u ”) | ||
| Mkpịsị aka ọla edo, Mbipụta Carbon, Peelable S / M | ||
| Solder nkpuchi agba | Green, Blue, White, Black, Clear, wdg. | |
| Impedance | Otu akara, ọdịiche, implanance coplanar na-achịkwa% 10% | |
| Ndepụta imecha ụdị | Usoro CNC; V-Akara / Akara; Punch | |
| Ndidi | Min Oghere ndidi (NPTH) ± 0.05mm | |
| Min Oghere ndidi (PTH) ± 0.075mm | ||
| Min Nlereanya ndidi ± 0.05mm |
Isiike PCB (ike)
| Hazie | Ihe | Ikike |  |
|
| Layer gụọ | Isiike-agbanwe PCB | 2 ～ 14 | ||
| Flex PCB | 1 ～ 10 | |||
| Bọdụ | Nkeji Ọkpụrụkpụ | 0.08 +/- 0.03mm | ||
| Max. Ọkpụrụkpụ | 6mm | |||
| Max. Nha | 485mm * 1000mm | |||
| Oghere & Oghere | Nkeji | 0.15mm | ||
| Min.Slot Oghere | 0.6mm | |||
| Akụkụ ruru | 10: 1 | |||
| Chọpụta | Min.Width / Oghere | 0.05 / 0.05mm | ||
| Ndidi | Chọpụta W / S. | 3 0.03mm | ||
| (W / S≥0.3mm: ± 10%) | ||||
| Oghere onu | ± 0.075mm | |||
| Oghere Dimension | ± 0.075mm | |||
| Impedance | 0 ≤ Uru ≤ 50Ω: ± 5Ω 50Ω ≤ Uru: ± 10% Ω | |||
| Ihe onwunwe | Nkọwapụta Basefilm | PI: 3mil 2mil 1mil 0.8mil 0.5mil | ||
| ED &RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | ||||
| Basefilm Isi soplaya | Shengyi / Taiflex / Dupont / Doosan / Thinflex | |||
| Nkọwapụta Coverlay | PI: 2mil 1mil 0.5mil | |||
| Agba LPI | Green / Yellow / White / Black / Blue / Uhie | |||
| PI Stiffener | T: 25um ～ 250um | |||
| FR4 Onye na-ebu ihe | T: 100um ～ 2000um | |||
| SUS Stiffener | T: 100um ～ 400um | |||
| AL Na-ebu ihe | T: 100um ～ 1600um | |||
| Mezie | 3M / Tesa / Nitto | |||
| EMI mkpuchi | Ihe nkiri Silver / Ọla kọpa / ink ọlaọcha | |||
| Elu imecha | OSP | 0,1 - 0,3um | ||
| HASL | Sn: 5um - 40um | |||
| HASL (Leed n'efu) | Sn: 5um - 40um | |||
| ENEPIG | Ni: 1.0 - 6.0um | |||
| Ba: 0.015-0.10um | ||||
| Au: 0.015 - 0.10um | ||||
| Tọ ọlaedo siri ike | Ni: 1.0 - 6.0um | |||
| Au: 0.02um - 1um | ||||
| Flash ọlaedo | Ni: 1.0 - 6.0um | |||
| Au: 0.02um - 0.1um | ||||
| ENIG | Ni: 1.0 - 6.0um | |||
| Au: 0.015um - 0.10um | ||||
| Immesion ọla ọcha | Ag: 0.1 - 0.3um | |||
| Ịkụnye Tin | Sn: 5um - 35um | |||